Ditra is a polyethylene uncoupling underlayment with a grid ditra is an uncoupling membrane designed for ceramic and stone tile installations on floors.
Ditra for floors.
The combination of these four essential functions allows for the successful installation of tile over a wide range of substrates including plywood osb concrete gypsum heated floors etc.
Ditra will forever change the way you lay tile.
The stud structure of ditra heat is specifically designed to allow for the easy installation of ditra heat e hk heating cables.
It provides uncoupling to prevent cracked tile and grout.
Schluter ditra heat integrates customizable comfortable electric floor warming with the functions associated with ditra.
The practice of decoupling has been performed for thousands of years by using a layer of sand under stone floors.
Ditra is 1 8 3 mm thick which minimizes tile assembly thickness and reduces transitions to lower surface coverings e g carpet engineered wood and vinyl.
Schluter ditra underlayment is an uncoupling membrane that allows the tile floor to move in plane relative to the substrate eliminating the major causes for cracked and delaminated tile.
Ditra is an uncoupling membrane designed for ceramic and stone tile installations on floors.
Ditra can be installed over a variety of subfloors including concrete plywood osb and radiant heated floors.
However today s lightweight construction methods can make the installation of hard surface coverings particularly challenging.
Ceramic and stone tiles are durable easy to maintain and hygienic representing the ideal surface coverings.
Ditra is the easiest way to waterproof your floor and prevent tile grout from cracking.
Floors with radiant heat.
It is made of polyethylene creating a waterproofing layer protecting the substrate.
Ditra was invented by schluter systems back in 1987 and is used extensively in commercial and residential tile installations.
That movement will cause tile cracks without a layer of motion absorbing material such as ditra.
It is made of polyethylene creating a waterproofing layer protecting the substrate.
Heat causes materials to expand and they shrink again when they cool.